Solder Voiding - Causes and Remedies
Tuesday, April 22 - 12:00 PM CST
Presented by Jerome McIntyre, Sales & Applications Engineer
Solder voiding is a persistent challenge in electronic assembly, directly affecting the reliability, mechanical strength, electrical integrity, and thermal dissipation of solder joints. While some level of voiding is inevitable, understanding its root causes and acceptable limits is essential for optimizing performance based on product design and application.
Join Jerome McIntyre, as he explores the key factors contributing to solder voiding and provides expert insights into material selection and process optimizations that can help minimize void formation. This webinar will offer practical solutions to improve solder joint quality, enhance reliability, and reduce defects in your assembly process.
Don’t miss this opportunity to gain actionable strategies to combat solder voiding in your manufacturing operations!
A Residue-Free Soldering Solution for Power Devices with Formic Acid Reflow
Thursday, May 29 - 12:00 PM CST
Presented by Shantanu Joshi, Head of Customer Solutions & Operational Excellence
Soldering power devices efficiently while ensuring long-term reliability has always been a challenge—especially when dealing with flux residues and additional cleaning steps. Join Shantanu Joshi, as he introduces an innovative Zero-Flux Residue solder paste designed specifically for formic acid reflow.
Unlike traditional rosin-based fluxes or solder preforms, this advanced formulation optimizes formic acid’s reduction potential while utilizing heat-resistant agents to maintain solder powder integrity during preheating. The result? A fully residue-free process, where all flux components evaporate before peak reflow temperatures—eliminating the need for post-soldering cleaning.
Discover how this breakthrough technology can streamline production, enhance soldering performance, lower manufacturing costs, and support sustainability efforts. Don't miss this opportunity to gain expert insights from Shantanu and explore the future of high-reliability soldering!
Enhancing Solder Joint Reliability Through Advanced Materials Development
Thursday, September 11 - 12:00 PM CST
Presented by Shantanu Joshi, Head of Customer Solutions & Operational Excellence
As electronic devices continue to shrink, ensuring reliability in automotive and high-reliability applications becomes increasingly challenging. Join Shantanu Joshi, as he explores strategies to enhance lead-free solder joint robustness through alternative solder alloys and flux innovations.
While SnAgCu alloys meet most industry needs, more demanding environments—such as under-the-hood applications and avionics—require advanced solutions. This webinar will present findings from soldering evaluations and accelerated thermal cycling tests on alternative lead-free alloys, including tin-silver-bismuth-indium compositions. Additionally, we’ll introduce KOKI’s innovative "crack-free" flux paste, specifically designed to resist residue cracking and maintain high insulation resistance under extreme conditions.
Don't miss this opportunity to gain expert insights from Shantanu and discover cutting-edge solutions to improve solder joint reliability in your most challenging applications!
Understanding and Preventing Dewetting Defects in SMT Soldering
Thursday, November 20th - 12:00 PM CST
Presented by Shantanu Joshi, Head of Customer Solutions & Operational Excellence
Presented by Shantanu Joshi, Head of Customer Solutions & Operational Excellence
Dewetting remains one of the most prevalent soldering defects in SMT manufacturing, accounting for nearly 25% of defect analysis requests received by KOKI Americas. Join Shantanu Joshi, as he explores the root causes of dewetting, its impact on solder joint reliability, and effective strategies to prevent it.
Drawing from over a decade of real-world case studies compiled through KOKI’s industry-renowned Defect Analysis Service, this webinar will provide practical insights and proven countermeasures to mitigate this critical issue. Learn how to identify, troubleshoot, and eliminate dewetting defects to optimize your soldering process, improve yield, and enhance long-term reliability.
Don't miss this opportunity to gain expert knowledge from Shantanu and take your soldering process to the next level!