When Cleaning Gets Hard: Solving Low-Standoff Challenges with Advanced No-Clean Solder Pastes
Speakers
Cleaning beneath low standoff components is one of the most persistent challenges in modern SMT production. As component geometries shrink, achieving reliable under-component cleanliness without increasing process aggressiveness becomes increasingly complex. In this webinar, KOKI Solder America explores how advanced no-clean solder paste formulations with engineered low-residue chemistries can significantly improve cleanability without compromising printability, wetting performance, or long-term reliability. explores how advanced no-clean solder paste formulations with engineered low-residue chemistries can significantly improve cleanability without compromising printability, wetting performance, or long-term reliability. explores how advanced no-clean solder paste formulations with engineered low-residue chemistries can significantly improve cleanability without compromising printability, wetting performance, or long-term reliability. explores how advanced no-clean solder paste formulations with engineered low-residue chemistries can significantly improve cleanability without compromising printability, wetting performance, or long-term reliability.
The session features real-world data from controlled soldering and cleaning trials, showing how flux residue chemistry directly affects:
Attendees will gain practical, data-backed insight into how aligning can reduce process intensity, increase throughput, and lower total manufacturing cost, while maintaining stringent reliability standards.• Under-component cleanliness
• Required cleaning chemistry concentration
• Belt speed and cycle time
• Overall process efficiency
Register to learn how to improve cleanliness performance without sacrificing production efficiency.
Featuring
Using SPI Data to Evaluate Solder Paste Printability Over Extended Stencil Cleaning Intervals
Speakers
Stencil cleaning frequency has a direct impact on print quality, process stability, and overall SMT line efficiency. But how often is cleaning truly necessary?
In this live webinar, KOKI and Koh Young share a data-driven analysis of solder paste printability using advanced Solder Paste Inspection (SPI) technology. By intentionally extending under-stencil cleaning intervals beyond standard production norms, the team leveraged SPI analytics to measure:
• Paste volume consistency
• Transfer efficiency
• Print stability across multiple cycles
The findings reveal how manufacturers can use real-time inspection data to confidently extend cleaning intervals, reduce unnecessary downtime, and increase throughput. All while maintaining consistent, high-quality print performance.
This session moves beyond fixed cleaning schedules and visual checks, demonstrating how SPI-driven process control enables smarter, evidence-based decisions on the SMT line.
Register now to learn how to turn inspection data into measurable operational gains.
Understanding and Preventing Dewetting Defects in SMT Soldering
Speakers
Dewetting is one of the most common and costly soldering defects in modern SMT manufacturing, representing nearly 25% of defect analysis requests received by KOKI.is one of the most common and costly soldering defects in modern SMT manufacturing, representing nearly 25% of defect analysis requests received by KOKI.
In this webinar, Jerome McIntyre of KOKI Solder America breaks down the root causes of dewetting, its impact on solder joint reliability, and the proven methods used to prevent it. Jerome McIntyre of KOKI Solder America breaks down the root causes of dewetting, its impact on solder joint reliability, and the proven methods used to prevent it.
Drawing from more than a decade of real-world case studies compiled through KOKI’s industry-recognized Defect Analysis Service, this session delivers practical, field-tested countermeasures that can be applied immediately on the production floor. Defect Analysis Service, this session delivers practical, field-tested countermeasures that can be applied immediately on the production floor.
Attendees will learn how to:
• Identify early indicators of dewetting defects
• Diagnose key process variables contributing to failure
• Implement corrective actions that improve yield, process stability, and long-term reliability process variables contributing to failure
• Implement corrective actions that improve yield, process stability, and long-term reliability
Register now to strengthen process control and reduce costly soldering defects before they impact production.